高通公司揭幕下一代Powerline通信设备,以支持扩大行业对车辆充电智能网格通信的需求
高通公司揭幕下一代Powerline通信设备,以支持扩大行业对车辆充电智能网格通信的需求
概括
Highlights:
- Supports advanced bidirectional communication in smart grid applications to help manage and balance energy flow between electric vehicles and the grid
- 高通技术正在与几乎所有全球,领先的汽车制造商及其供应基础合作,以支持联合充电系统国际标准,用于充电电动汽车
- In alignment with Qualcomm Incorporated’s environmental sustainability efforts, this device also has the potential to contribute to substantially reducing greenhouse gas emissions
SAN DIEGO, June 9, 2022 /3BL Media/ - In continued efforts to support the growing electric vehicle (EV) segment, Qualcomm Technologies, Inc. announced a next-generation powerline communication (PLC) device, the QCA7006AQ, designed to address the needs for electric vehicle (EV) charging station communications – also known as electric vehicle supply equipment (EVSE) – that use global Combined Charging System (CCS). The PLC device is based on Qualcomm Technologies’ market proven QCA700X family of products, which have been widely adopted in EV on-board charging units and charging stations across the globe. The QCA7006AQ is compliant with the HomePlug Green PHY (HPGP) specification, which is the leading specification for implementing Vehicle-to-Grid (V2G) systems.
智能电网集成使车辆可以通过插头和充电自动付款在网络上无缝验证电动汽车充电,从而协调往返网格和家庭的能源的时机和方向。CCS标准支持的智能网格充电应用程序可以使用户灵活地选择最佳充电时间并根据需要从电动汽车中提取能量,从而支持日益增长的电动汽车充电需求,同时最大程度地减少峰值负载发电和分配要求。
This is Qualcomm Technologies’ first QCA700X PLC device designed to support an Ethernet digital interface and that is qualified to support an ambient operating temperature range of -40°C to +105°C (AEC-Q100 Automotive Grade 2). As an optional feature, the QCA7006AQ also supports HomePlug Audio Video (HPAV) streaming at PHY rate exceeding 200 Mbps, allowing EV customers an alternate wired data connection to the cloud through the charging station. The introduction of the Ethernet digital interface, in addition to Serial Peripheral Interface (SPI), the AEC-Q100 Grade 2 compliance, and the HPAV operation mode, supports expanded design flexibility for future devices.
“By further expanding our PLC device portfolio, in addition to engineering the fully integrated, scalable Snapdragon Digital Chassis solution for automakers, Qualcomm Technologies is supporting an evolving automotive industry driven by the EV vehicle architecture,” said Lars Boeryd, Sr. Director Product Marketing, Automotive at Qualcomm Technologies, Inc. “As a leading supplier of PLC HPGP devices for smart-grid communications, we are committed to helping our customers succeed in a growing EV industry increasingly adopting the CCS standard.”
The QCA7006AQ is planned to be available for production by early Q4 2022, and samples are available today.Additional information can be found这里。
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QCA7006AQ and the Snapdragon Digital Chassis are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
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